<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>新闻资讯 &#8211; ZAK 泽科电子</title>
	<atom:link href="https://www.zakcn.com/category/news/feed" rel="self" type="application/rss+xml" />
	<link>https://www.zakcn.com</link>
	<description>泛半导体产业链综合服务商 - 半导体设备&#124;耗材&#124;厂务&#124;改造&#124;智能化&#124;MES&#124;猎头&#124;工艺研发&#124;产能对接&#124;SiC&#124;化合物&#124;先进封装&#124;光电LED&#124;光伏</description>
	<lastBuildDate>Tue, 25 Feb 2025 05:18:36 +0000</lastBuildDate>
	<language>zh-Hans</language>
	<sy:updatePeriod>
	hourly	</sy:updatePeriod>
	<sy:updateFrequency>
	1	</sy:updateFrequency>
	<generator>https://wordpress.org/?v=7.0</generator>

<image>
	<url>https://www.zakcn.com/wp-content/uploads/2024/04/cropped-logo-32x32.png</url>
	<title>新闻资讯 &#8211; ZAK 泽科电子</title>
	<link>https://www.zakcn.com</link>
	<width>32</width>
	<height>32</height>
</image> 
	<item>
		<title>2025中国半导体行业展会及论坛</title>
		<link>https://www.zakcn.com/news/20251976.html</link>
					<comments>https://www.zakcn.com/news/20251976.html#respond</comments>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Tue, 25 Feb 2025 05:18:36 +0000</pubDate>
				<category><![CDATA[新闻资讯]]></category>
		<category><![CDATA[行业资讯]]></category>
		<category><![CDATA[2025]]></category>
		<category><![CDATA[半导体]]></category>
		<category><![CDATA[展会]]></category>
		<category><![CDATA[论坛]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1976</guid>

					<description><![CDATA[时间 项目 类型 地点 2025年03月26-28日 国际半导体展览会 SEMICON CHINA 展会&#038;am [&#8230;]]]></description>
		
					<wfw:commentRss>https://www.zakcn.com/news/20251976.html/feed</wfw:commentRss>
			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>半导体晶圆减薄技术全景报告：突破性进展、核心挑战与未来趋势</title>
		<link>https://www.zakcn.com/news/20251972.html</link>
					<comments>https://www.zakcn.com/news/20251972.html#respond</comments>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Sat, 22 Feb 2025 08:01:04 +0000</pubDate>
				<category><![CDATA[技术前沿]]></category>
		<category><![CDATA[新闻资讯]]></category>
		<category><![CDATA[ALE]]></category>
		<category><![CDATA[GaN]]></category>
		<category><![CDATA[LAG]]></category>
		<category><![CDATA[SiC]]></category>
		<category><![CDATA[晶圆减薄]]></category>
		<category><![CDATA[激光辅助研磨]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1972</guid>

					<description><![CDATA[一、技术背景与行业需求 技术背景 在半导体制造的复杂流程中，晶圆减薄作为关键的后道工艺，其重要性不容小觑。从早 [&#8230;]]]></description>
		
					<wfw:commentRss>https://www.zakcn.com/news/20251972.html/feed</wfw:commentRss>
			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>先进封装：半导体产业的新竞技场</title>
		<link>https://www.zakcn.com/news/20251967.html</link>
					<comments>https://www.zakcn.com/news/20251967.html#respond</comments>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Fri, 14 Feb 2025 06:42:44 +0000</pubDate>
				<category><![CDATA[新闻资讯]]></category>
		<category><![CDATA[行业资讯]]></category>
		<category><![CDATA[2.5D]]></category>
		<category><![CDATA[CoWoS]]></category>
		<category><![CDATA[Foveros]]></category>
		<category><![CDATA[InFO]]></category>
		<category><![CDATA[TSV]]></category>
		<category><![CDATA[X-Cube]]></category>
		<category><![CDATA[XDFOI]]></category>
		<category><![CDATA[先进封装]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1967</guid>

					<description><![CDATA[导语：随着摩尔定律逼近物理极限，先进封装技术正在改写半导体产业格局。台积电、英特尔等晶圆厂与日月光、长电科技等 [&#8230;]]]></description>
		
					<wfw:commentRss>https://www.zakcn.com/news/20251967.html/feed</wfw:commentRss>
			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>2025，最新：先进封装行业，趋势报告！-CoWoS</title>
		<link>https://www.zakcn.com/news/20251952.html</link>
					<comments>https://www.zakcn.com/news/20251952.html#respond</comments>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Fri, 14 Feb 2025 06:19:11 +0000</pubDate>
				<category><![CDATA[技术前沿]]></category>
		<category><![CDATA[新闻资讯]]></category>
		<category><![CDATA[CoWoS]]></category>
		<category><![CDATA[先进封装]]></category>
		<category><![CDATA[封装]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1952</guid>

					<description><![CDATA[什么是CoWoS？]]></description>
		
					<wfw:commentRss>https://www.zakcn.com/news/20251952.html/feed</wfw:commentRss>
			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>剑指千亿！武汉光谷启动建设化合物半导体、存储器等四大产业创新街区</title>
		<link>https://www.zakcn.com/news/20251950.html</link>
					<comments>https://www.zakcn.com/news/20251950.html#respond</comments>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Fri, 14 Feb 2025 06:10:22 +0000</pubDate>
				<category><![CDATA[新闻资讯]]></category>
		<category><![CDATA[行业资讯]]></category>
		<category><![CDATA[光谷]]></category>
		<category><![CDATA[化合物]]></category>
		<category><![CDATA[半导体]]></category>
		<category><![CDATA[存储]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1950</guid>

					<description><![CDATA[2月8日，武汉市东湖高新区党工委（扩大）会议暨2025年度工作会议举行。从会上获悉，2025年，东湖高新区将抢 [&#8230;]]]></description>
		
					<wfw:commentRss>https://www.zakcn.com/news/20251950.html/feed</wfw:commentRss>
			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>HBM的关键工艺—硅通孔TSV的能与不能</title>
		<link>https://www.zakcn.com/news/tech/20241885.html</link>
					<comments>https://www.zakcn.com/news/tech/20241885.html#respond</comments>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Tue, 14 May 2024 14:58:24 +0000</pubDate>
				<category><![CDATA[技术前沿]]></category>
		<category><![CDATA[HBM]]></category>
		<category><![CDATA[TSV]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1885</guid>

					<description><![CDATA[技术工艺：晶圆级封装的关键工艺——硅通孔 半导体封装的四个主要作用，包括机械保护、电气连接、机械连接和散热。封 [&#8230;]]]></description>
		
					<wfw:commentRss>https://www.zakcn.com/news/tech/20241885.html/feed</wfw:commentRss>
			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Chiplets和3D封装技术详解</title>
		<link>https://www.zakcn.com/news/tech/20241756.html</link>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Mon, 29 Apr 2024 08:49:23 +0000</pubDate>
				<category><![CDATA[技术前沿]]></category>
		<category><![CDATA[3D]]></category>
		<category><![CDATA[Chiplets]]></category>
		<category><![CDATA[CoWoS]]></category>
		<category><![CDATA[Flip-chip]]></category>
		<category><![CDATA[InFO]]></category>
		<category><![CDATA[TSMC]]></category>
		<category><![CDATA[先进封装]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1756</guid>

					<description><![CDATA[Outline TSMC Integration Technologies TSMC 3DFabric New [&#8230;]]]></description>
		
		
		
			</item>
		<item>
		<title>台积电官宣1.6nm同时公布多项新技术</title>
		<link>https://www.zakcn.com/news/info/20241753.html</link>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Sun, 28 Apr 2024 15:22:06 +0000</pubDate>
				<category><![CDATA[行业资讯]]></category>
		<category><![CDATA[CoWoS]]></category>
		<category><![CDATA[N4C]]></category>
		<category><![CDATA[SoIC]]></category>
		<category><![CDATA[先进封装]]></category>
		<category><![CDATA[台积电]]></category>
		<category><![CDATA[硅光]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1753</guid>

					<description><![CDATA[台积电周三表示，一种名为“A16”的新型芯片制造技术将于 2026 年下半年投入生产，与长期竞争对手英特尔展开 [&#8230;]]]></description>
		
		
		
			</item>
		<item>
		<title>半导体碳化硅(SiC) 衬底加工技术进展详解</title>
		<link>https://www.zakcn.com/news/tech/20241084.html</link>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Wed, 17 Apr 2024 15:42:41 +0000</pubDate>
				<category><![CDATA[技术前沿]]></category>
		<category><![CDATA[SiC]]></category>
		<category><![CDATA[减薄]]></category>
		<category><![CDATA[工艺]]></category>
		<category><![CDATA[衬底]]></category>
		<guid isPermaLink="false">http://localhost/?p=1084</guid>

					<description><![CDATA[经过单晶生长获得SiC晶碇后，紧接着就是 SiC 衬底的制备，通常需要历经磨平、滚圆、切割、研磨（减薄)、机械 [&#8230;]]]></description>
		
		
		
			</item>
		<item>
		<title>2024年车用碳化硅重大利好</title>
		<link>https://www.zakcn.com/news/info/20241081.html</link>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Wed, 17 Apr 2024 15:36:14 +0000</pubDate>
				<category><![CDATA[行业资讯]]></category>
		<category><![CDATA[SiC]]></category>
		<category><![CDATA[车规]]></category>
		<guid isPermaLink="false">http://localhost/?p=1081</guid>

					<description><![CDATA[以特斯拉2023年销售170多万辆Model Y/3计算，该公司一年需要60至80万片碳化硅晶圆。Model  [&#8230;]]]></description>
		
		
		
			</item>
		<item>
		<title>泽科电子官网上线</title>
		<link>https://www.zakcn.com/news/com/2024202.html</link>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Wed, 27 Mar 2024 07:41:54 +0000</pubDate>
				<category><![CDATA[企业动态]]></category>
		<category><![CDATA[官网]]></category>
		<category><![CDATA[泽科]]></category>
		<category><![CDATA[泽科电子]]></category>
		<guid isPermaLink="false">http://localhost/?p=202</guid>

					<description><![CDATA[ 2024年4月，泽科电子官网 www.zakcn.com  完成工信部备案，成功上线。]]></description>
		
		
		
			</item>
		<item>
		<title>小米SU7单车成本拆解</title>
		<link>https://www.zakcn.com/news/info/202461.html</link>
					<comments>https://www.zakcn.com/news/info/202461.html#respond</comments>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Wed, 27 Mar 2024 05:11:25 +0000</pubDate>
				<category><![CDATA[行业资讯]]></category>
		<category><![CDATA[功率器件]]></category>
		<category><![CDATA[小米SU7]]></category>
		<category><![CDATA[成本]]></category>
		<category><![CDATA[拆解]]></category>
		<category><![CDATA[新能源汽车]]></category>
		<guid isPermaLink="false">http://localhost/?p=61</guid>

					<description><![CDATA[1、整车成本构成 成分类别 单车价格(元) 占比 一、材料（BOM） 257,022 85.67%       [&#8230;]]]></description>
		
					<wfw:commentRss>https://www.zakcn.com/news/info/202461.html/feed</wfw:commentRss>
			<slash:comments>0</slash:comments>
		
		
			</item>
	</channel>
</rss>
