<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>SiC产业链 &#8211; ZAK 泽科电子</title>
	<atom:link href="https://www.zakcn.com/category/solution/sic/feed" rel="self" type="application/rss+xml" />
	<link>https://www.zakcn.com</link>
	<description>泛半导体产业链综合服务商 - 半导体设备&#124;耗材&#124;厂务&#124;改造&#124;智能化&#124;MES&#124;猎头&#124;工艺研发&#124;产能对接&#124;SiC&#124;化合物&#124;先进封装&#124;光电LED&#124;光伏</description>
	<lastBuildDate>Mon, 06 Apr 2026 13:48:48 +0000</lastBuildDate>
	<language>zh-Hans</language>
	<sy:updatePeriod>
	hourly	</sy:updatePeriod>
	<sy:updateFrequency>
	1	</sy:updateFrequency>
	<generator>https://wordpress.org/?v=6.9.4</generator>

<image>
	<url>https://www.zakcn.com/wp-content/uploads/2024/04/cropped-logo-32x32.png</url>
	<title>SiC产业链 &#8211; ZAK 泽科电子</title>
	<link>https://www.zakcn.com</link>
	<width>32</width>
	<height>32</height>
</image> 
	<item>
		<title>功率半导体静态参数测试解决方案</title>
		<link>https://www.zakcn.com/solution/sic/20241655.html</link>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Wed, 24 Apr 2024 15:00:48 +0000</pubDate>
				<category><![CDATA[SiC产业链]]></category>
		<category><![CDATA[ZAK]]></category>
		<category><![CDATA[功率器件]]></category>
		<category><![CDATA[测试机]]></category>
		<category><![CDATA[解决方案]]></category>
		<category><![CDATA[静态测试]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1655</guid>

					<description><![CDATA[行业背景 功率半导体是电子产业链中最核心的一类器件，能够实现电能转换和电路控制作用。功率半导体包括功率半导体分 [&#8230;]]]></description>
		
		
		
			</item>
		<item>
		<title>金刚石类耗材在SiC产业链中成套解决方案</title>
		<link>https://www.zakcn.com/solution/sic/20241179.html</link>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Thu, 18 Apr 2024 10:44:03 +0000</pubDate>
				<category><![CDATA[SiC产业链]]></category>
		<category><![CDATA[CMP]]></category>
		<category><![CDATA[GRIND]]></category>
		<category><![CDATA[SiC]]></category>
		<category><![CDATA[SLCING]]></category>
		<category><![CDATA[减薄]]></category>
		<category><![CDATA[切割]]></category>
		<category><![CDATA[切割液]]></category>
		<category><![CDATA[切片]]></category>
		<category><![CDATA[抛光]]></category>
		<category><![CDATA[抛光液]]></category>
		<category><![CDATA[研磨]]></category>
		<category><![CDATA[碳化硅]]></category>
		<category><![CDATA[耗材]]></category>
		<category><![CDATA[金刚线]]></category>
		<guid isPermaLink="false">http://localhost/?p=1179</guid>

					<description><![CDATA[&#160; &#160; 　　确保满足客户在SiC研磨抛光各工段加工参数的前提下，结合客户的实际情况进行有针 [&#8230;]]]></description>
		
		
		
			</item>
	</channel>
</rss>
