<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>封装 &#8211; ZAK 泽科电子</title>
	<atom:link href="https://www.zakcn.com/tag/%e5%b0%81%e8%a3%85/feed" rel="self" type="application/rss+xml" />
	<link>https://www.zakcn.com</link>
	<description>泛半导体产业链综合服务商 - 半导体设备&#124;耗材&#124;厂务&#124;改造&#124;智能化&#124;MES&#124;猎头&#124;工艺研发&#124;产能对接&#124;SiC&#124;化合物&#124;先进封装&#124;光电LED&#124;光伏</description>
	<lastBuildDate>Sun, 16 Feb 2025 04:50:40 +0000</lastBuildDate>
	<language>zh-Hans</language>
	<sy:updatePeriod>
	hourly	</sy:updatePeriod>
	<sy:updateFrequency>
	1	</sy:updateFrequency>
	<generator>https://wordpress.org/?v=6.9.4</generator>

<image>
	<url>https://www.zakcn.com/wp-content/uploads/2024/04/cropped-logo-32x32.png</url>
	<title>封装 &#8211; ZAK 泽科电子</title>
	<link>https://www.zakcn.com</link>
	<width>32</width>
	<height>32</height>
</image> 
	<item>
		<title>2025，最新：先进封装行业，趋势报告！-CoWoS</title>
		<link>https://www.zakcn.com/news/20251952.html</link>
					<comments>https://www.zakcn.com/news/20251952.html#respond</comments>
		
		<dc:creator><![CDATA[fisherpop]]></dc:creator>
		<pubDate>Fri, 14 Feb 2025 06:19:11 +0000</pubDate>
				<category><![CDATA[技术前沿]]></category>
		<category><![CDATA[新闻资讯]]></category>
		<category><![CDATA[CoWoS]]></category>
		<category><![CDATA[先进封装]]></category>
		<category><![CDATA[封装]]></category>
		<guid isPermaLink="false">https://www.zakcn.com/?p=1952</guid>

					<description><![CDATA[什么是CoWoS？]]></description>
		
					<wfw:commentRss>https://www.zakcn.com/news/20251952.html/feed</wfw:commentRss>
			<slash:comments>0</slash:comments>
		
		
			</item>
	</channel>
</rss>
